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Apex Microtechnology has developed a household of units with built-in silicon carbide (SiC) MOSFET expertise, bettering efficiency and energy density.
Energy functions are transferring towards options that includes smaller footprint and better effectivity. To extend the ability density, which in flip permits the gadget to be housed in a smaller bundle, SiC is an efficient candidate for changing silicon in energy discretes and modules. As a consequence of their superior properties, SiC MOSFETs are extensively utilized in energy functions wherein excessive switching frequency, voltage, present, and effectivity are required.
Their skill to function at junction temperatures larger than these withstood by silicon additionally permits SiC units to realize higher thermal administration, which is one other benefit for shrinking the die measurement.
Silicon–based mostly excessive–energy discretes and modules usually require cooling options based mostly on cumbersome heatsinks, which have an effect on the scale of the general answer. However, SiC provides the chance to ship unprecedented ranges of energy density in small–footprint packages with out compromising thermal administration.
Silicon Carbide
In contrast with silicon, SiC provides a number of advantages, equivalent to its decrease on–resistance versus each temperature and present ranges. A low RDS(on) leads to a greater present versus voltage efficiency and decrease switching losses. Despite the fact that the price of SiC is larger in comparison with silicon, its diminished thermal load, less complicated cooling, and larger reliability compensate for this downside.
Beginning with these issues, Apex — a supplier of energy analog monolithic, hybrid, and open–body parts for a variety of business, take a look at and measurement, medical, aerospace, semi–cap, and navy functions — developed new merchandise exploiting the properties of SiC. These merchandise embrace the SA110, a half–bridge switching module with built-in gate driver, and the SA310, a 3–section energy–switching module with built-in gate driver.
Correct design permits you to successfully spotlight all of the properties of SiC. In designing its excessive–energy units, Apex has fastidiously thought of the impact of parasitics (which may exceed the on–resistance), hint inductance, and hint resistance. Determine 1 reveals the block diagram of the Apex SA310KR, a SiC–based mostly three–section energy module with built-in gate driver.
One of the vital demanding challenges confronted by Apex in the course of the design of the SiC–based mostly energy units was the co–packaging of the MOSFET driver with MOSFET gate drivers. As a result of excessive switching frequency, which is one main functionality supplied by SiC, the present slew charge (di/dt) may be very excessive. This requires a cautious routing of traces on the PCB format, avoiding the attainable formation of noise or interference between adjoining traces (crosstalk).
Furthermore, at larger switching frequencies, the pores and skin impact will not be negligible, as it may scale back the efficient cross–sectional space of the bundle’s enter/output connections, growing {the electrical} resistance. These potential points have been solved by Apex by utilizing a sophisticated thick–movie technology on the substrate, double–printing the traces to thicken them and scale back their impedance.
An additional benefit of Apex’s co–packaging answer is that the gate drivers are positioned very near the SiC MOSFETs, thus lowering the impact of inductance within the gate, which turns into outstanding at larger switching charges. By paying extra consideration to thermal paths, packaging, and supplies, the corporate has been in a position to obtain glorious thermal administration, in keeping with Apex. That permits, for example, the SA110 to dissipate an influence of 89 W, whereas working in a temperature vary from –40˚C to 125˚C.
The SA110, accessible in a small–footprint 12–pin Energy SIP (DP) bundle, options an built-in gate drive management, a really excessive (400–kHz max) switching frequency, and 28 A of steady output present within the A–grade variant. It’s appropriate for functions equivalent to AC/DC and DC/DC converters, energy issue correction (PFC), and motor drives.
The SA310, which is available in a 16–pin Energy DIP (KR) bundle, integrates three impartial remoted half–bridges, which give as much as 80 A peak output present below direct microcontroller or DSC management. Constructed on a thermally conductive however electrically remoted substrate to offer essentially the most versatility and ease in heatsinking, the SA310 addresses the necessities of functions equivalent to motor management (BLDCs), variable–frequency drives, DC/AC converters, energy inverters, take a look at tools, and MRI predominant coil provides.
Each units present safety capabilities, equivalent to undervoltage lockout operate and lively Miller clamping, to scale back switching noise and enhance reliability.
Apex SA111
The Arizona–headquartered firm has lately introduced the SA111, a SiC–based mostly excessive–energy half–bridge module that delivers excessive ranges of energy density in a compact proprietary PQ bundle.
Accessible in an SMD bundle of simply 20 × 20 mm, the SA111 (Determine 2) can present steady output currents of 32 A, handle provide voltages of as much as 650 V, and obtain switching frequencies of as much as 1 MHz (remaining within the secure working space). The floor–mount bundle has a excessive thermal effectivity and high–facet cooling. That permits the customers to optimize the board format, putting the heatsink immediately on high of the gadget.
The SiC half–bridge energy module is the best answer for functions equivalent to MRI gradient coil drives, magnetic bearings, motor drives, take a look at tools, server followers, PFC, and AC/DC and DC/DC converters. SiC MOSFETs additionally allow the SA111 to face up to larger thermal stress, managing junction temperatures of as much as 175˚C.
That includes an built-in gate driver, undervoltage lockout, and lively Miller clamping, the SA111 SiC energy module is a completely built-in answer permitting for elevated gadget management and safety. SiC drastically improves thermal administration, as much less warmth is generated and there may be thus much less want for cooling of the module itself and the module could be smaller. Equally, the ability provide for the module could be smaller and dissipate much less warmth and sure be inexpensive as nicely.
Because of its floor–mount bundle and exceptionally small footprint, the SA111 permits designers to maximise board actual property, permitting for the usage of a number of units in circuit designs with excessive energy density necessities. Pattern items of SA111PQ are presently accessible for certified buyer functions, with mass manufacturing quantity ramp scheduled for summer season 2022.
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